Increase throughput and up-time of automated test equipment

High density, modular testing for CPUs, GPUs, and SoCs

Increasing capacity of semiconductor burn-in thermal chambers

Increasing demands for more efficient test capacity on the factory floor

Semiconductor manufacturers are placing greater demands on Automatic Test Equipment (ATE) companies to design test systems that will meet the ever-increasing IC demand as quickly and reliably – and with as little added cost as possible.

IC manufacturers consider Cost of Test (CoT) as a cost adder that, while required and necessary, only subtracts from product margins, requires ever increasing factory floorspace and does not improve cycle time and yield.

ATE system manufacturers need to develop test systems that meet the technical needs of new IC products and don’t contribute to yield loss and take up the same or less factory floorspace as the generation being replaced.

High density, high efficiency power modules

High-density and high-efficiency Vicor power modules enable ATE system design engineers to implement new power delivery networks that will allow for increasing test head pin count in the same or smaller size test head. New data center, military, automotive and industrial ICs consume ever-increasing amounts of power and have many, varied voltage levels.

The Vicor modular approach to power enables ATE manufacturers to readily scale power levels and support different voltages to enable rapid development and fast time-to-market.